Chosen Solution. The audio IC is not the problem it is the trace gong from the pad on the board to the resistor. This trace separates from the pad due to flexing. It is safer to re-ball the IC as the solder on the new chips takes a lot more heat to melt and can cause the dreaded “Searching no service” which will require the baseband CPU to
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In this video, I show you how to properly repair audio issues on an iPhone 7 or iPhone 7 Plus by removing the Audio IC and repairing the damaged traces locat
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iphone 7 plus audio ic jumper